with good experience in removing BGA devices we can remove and replace to acceptable classes required.
Fine pitch, thermal padded QFN's, nothing is too difficult
A small, hard-working Assembly company. Established in 1987 as a Design Bureau supplying Pcb's, Phototools and consultany, we expanded into an assembly company 10 years ago and have consistantly met capability requirements and we are equipped to meet small to medium and medium to high volumes.
6 headed pick and place
At SMB we have recently purchased a brand new Heller 1707 mk III reflow oven.
7 stage reflow computer controlled
Onboard profiling with temperature control charts
Fast throughput for PB Free applications
Our Samsung CP45 Neo is a reliable production pick and place machine capable of placing almost anything.
6 heads and automatic intelligent optimization for high speed changeovers
excellent flexibility for placing BGA deivices and fine pitch QFP's accurately
Pin block system for accurately supporting primary side without risk
Check out our Facebook page for our equipment and Lab specs.